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Cleaning Solution

Features

    Suitable for the cleaning or flux residues before molding of high-capacity PBGA, Flip-Chip, SIP, Lead Frame, IC substrate and other device

Features

    Suitable for cleaning PCBA in larga quantities, and completing the clean ing, rinsing and drying processes in-line

Features

    Suitable for cleaning PCBA in larga quantities, and completing the cleaning, rinsing and drying processes in-line

Features

    Throughly clean the residual flux and inorganic substances on the surface of PCBA products

Features

    Using WIN7 System, touch screen control the entire cleaning process to be completed automatically LAN interface

Features

    Suitable fot in-line drying of the cleaned PCBA to remove water droplets and moisture residues to meet the needs of the next process.

Features

    A high-pressure spray system dedicated to cleaning stencil, misprinted boards, PCB/PCBA, with water-based cleaning fluid

Features

    High pressure spray dedicated to cleaning stencil, PCB,PCBA printing scraper

Features

    Patented design, close-touch ultrasonic + spray claening, the stencil does not need to be soaked

Features

    Stainless steel body: Beautiful, wear-resistant, corrosion-ressistant in-line with environmental protection requierements and standards

Features

    Innovative appearance technology, using rotary ultrasonic + two spray, cleaning thoroughly

Features

    Suitable for surface cleaning of all kinds of workpieces, such as wave soldering fixture, reflow soldering condensers, machine parts, etc

Features

    The appearance adopts streamlined design, beautiful and generous

Features

    The appearance adopts streamlined design, beautiful and generous

Features

    Dedicated to cleaning various condensers with water-based cleaning fluid

DI

Features

    The machine is composed of quartz sand filter, activated carbon filter, high pressure pump, RO components, UV sterilizer, pressure sensor

Features

    It is mainly used to clean the surface dust particle of water, holder CMOS body, LCD, LENS, VCM, CDD, etc.

Features

    Mainly used for cleaning the micro-dust partilcles on the surface of camera module, holder, CMOS body, Wafer, etc.

Features

    Using touch screen control interface, easy to understand